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MCP1630
High-Speed, Microcontroller-Adaptable, Pulse Width Modulator
Features
* High-Speed PWM Operation (12 ns Current Sense to Output Delay) * Operating Temperature Range: -40C to +125C * Precise Peak Current Limit (5%) * CMOS Output Driver (Drives MOSFET Driver or Low-Side N-channel MOSFET Directly) * External Oscillator Input (from PICmicro(R) Microcontroller) * External Voltage Reference Input (for adjustable voltage or current output application) * Peak Current Mode Operation to 1 MHz * Low Operating Current: 2.8 mA, typical * Fast Output Rise and Fall Times (5.9 ns and 6.2 ns) * Undervoltage Lockout * Output Short Circuit Protection * Overtemperature Protection
Description
The MCP1630 is a high-speed Pulse Width Modulator (PWM) used to develop intelligent power systems. When used with a microcontroller, the MCP1630 will control the power system duty cycle to provide output voltage or current regulation. The microcontroller can be used to adjust output voltage or current, switching frequency, maximum duty cycle and other features making the power system more intelligent and adaptable. Typical applications include smart battery chargers, intelligent power systems, brick DC/DC converters, AC power-factor correction, multiple output power supplies, multi-phase power supplies and more. The MCP1630 inputs were developed to be easily attached to the I/O of a microcontroller. The microcontroller supplies the oscillator and reference to the MCP1630 to provide the most flexible and adaptable power system. The power system switching frequency and maximum duty cycle are set using the I/O of the microcontroller. The reference input can be external, a D/A converter output or as simple as an I/O output from the microcontroller. This enables the power system to adapt to many external signals and variables in order to optimize performance and facilitate calibration. When operating in current mode, a precise limit is set on the peak current. With the fast comparator speed (typically 12 ns), the MCP1630 is capable of providing a tight limit on the maximum switch current over a wide input voltage range when compared to other high-speed PWM controllers. Additional protection features include: undervoltage lockout, overtemperature and overcurrent.
Applications
Intelligent Power Systems Smart Battery Charger Applications Multiple Output/Multiple Phase Converters Output Voltage Calibration AC Power Factor Correction VID Capability (Programmed and calibrated by PICmicro Microcontroller) * Buck/Boost/Buck-Boost/SEPIC/Flyback/Isolated Converters * Parallel Power Supplies * * * * * *
Package Type 8-Pin MSOP
COMP FB CS OSC IN
1 2 3 4 8 7 6 5
MCP1630
VREF VIN VEXT GND
2004 Microchip Technology Inc.
DS21896A-page 1
MCP1630
Functional Block Diagram MCP1630 High-Speed PWM
VIN Overtemperature 0.1 A OSC IN UVLO VEXT VIN
Note VIN S Q GND
0.1 A CS COMP VIN FB VREF EA + 2R R 2.7V Clamp Note: 100 k + Comp R Q
Latch Truth Table S 0 0 1 1 R 0 1 0 1 Q Qn 1 0 1
During overtemperature, VEXT driver is high-impedance.
DS21896A-page 2
2004 Microchip Technology Inc.
MCP1630
Typical Application Circuit
MCP1630 NiMH Battery Charger and Fuel Gauge Application Diagram Cc +8V to +15V Input Voltage SEPIC Converter 4 NiMH Cells +5V Bias Cin Cout 1:1 N-channel MOSFET ISW IBATT +VBATT
MCP1630
5.7V VIN COMP VEXT FB OSC IN CS VREF GND +VBATT +5V Bias +
3V
PIC16LF818
PWM OUT
0V VDD
MCP1700
3.0V SOT23 VDD A/D 1/2 MCP6042 + VDD I2CTM To System A/D 1/2 MCP6042 +
2004 Microchip Technology Inc.
DS21896A-page 3
MCP1630
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDD...................................................................................6.0V Maximum Voltage on Any Pin .. (VGND - 0.3)V to (VIN + 0.3)V VEXT Short Circuit Current ...........................Internally Limited Storage temperature .....................................-65C to +150C Maximum Junction Temperature, TJ ........................... +150C Continuous Operating Temperature Range ..-40C to +125C ESD protection on all pins, Human Body Model............... 3 kV
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 F, VIN for typical values = 5.0V, TA = -40C to +125C. Parameters Input Voltage Input Operating Voltage Input Quiescent Current Oscillator Input External Oscillator Range Min. Oscillator High Time Min. Oscillator Low Time Oscillator Rise Time Oscillator Fall Time Oscillator Input Voltage Low Oscillator Input Voltage High Oscillator Input Capacitance External Reference Input Reference Voltage Input Error Amplifier Input Offset Voltage Error Amplifier PSRR Common Mode Input Range Common Mode Rejection Ratio Open-loop Voltage Gain Low-level Output Gain Bandwidth Product Error Amplifier Sink Current Error Amplifier Source Current Note 1: AVOL VOL GBWP ISINK ISOURCE VOS PSRR VCM -4 80 GND - 0.3 -- 85 -- -- 5 -2 0.1 99 -- 80 95 25 3.5 11 -9 +4 -- VIN -- -- GND + 50 -- -- -- mV dB V dB dB mV MHz mA mA VIN = 3.0V to 5.0V, VCM = 1.2V Note 2, Note 3 VIN = 5V, VCM = 0V to 2.5V RL = 5 k to VIN/2, 100 mV < VEAOUT < VIN - 100 mV, VCM = 1.2V RL = 5 k to VIN/2 VIN = 5V VIN = 5V, VREF = 1.2V, VFB = 1.4V, VCOMP = 2.0V VIN = 5V, VREF = 1.2V, VFB = 1.0V, VCOMP = 2.0V, Absolute Value VREF 0 -- VIN V Note 2, Note 3 FOSC TOH_MIN. TOL_MIN. TRISE TFALL VL VH COSC -- -- 0.01 0.01 -- 2.0 -- 10 -- -- -- -- 5 10 10 0.8 -- 1 MHz ns s s V V pf Note 2 Note 2 Note 1 VIN I(VIN) 3.0 -- -- 2.8 5.5 4.5 V mA IEXT = 0 mA, FOSC IN = 0 Hz Sym Min Typ Max Units Conditions
Capable of higher frequency operation depending on minimum and maximum duty cycles needed. External oscillator input (OSC IN) rise and fall times between 10 ns and 10 s used for characterization testing. Signal levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum values. Not production tested. The reference input of the internal amplifier is capable of rail-to-rail operation.
2:
3:
DS21896A-page 4
2004 Microchip Technology Inc.
MCP1630
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 F, VIN for typical values = 5.0V, TA = -40C to +125C. Parameters Current Sense Input Maximum Current Sense Signal Delay From CS to VEXT Minimum Duty Cycle Current Sense Input Bias Current Internal Driver RDSON P-channel RDSON N-channel VEXT Rise Time VEXT Fall Time Protection Features Under Voltage Lockout Under Voltage Lockout Hysteresis Thermal Shutdown Thermal Shutdown Hysteresis Note 1: UVLO UVLO_HYS TSHD TSHD_HYS 2.7 50 -- -- -- 75 150 18 3.0 150 -- -- V mV C C VIN falling, VEXT low state when in UVLO RDSon_P RDSon_N TRISE TFALL -- -- -- -- 10 7 5.9 6.2 30 30 18 18 ns ns CL = 100 pF Typical for VIN = 3V CL = 100 pF Typical for VIN = 3V VCS_MAX TCS_VEXT DCMIN ICS_B 0.85 -- -- -- 0.9 12 -- -0.1 0.95 25 0 -- V ns % A VFB = VREF + 0.1V, VCS = GND VIN = 5V Set by maximum error amplifier clamp voltage, divided by 3. Sym Min Typ Max Units Conditions
Capable of higher frequency operation depending on minimum and maximum duty cycles needed. External oscillator input (OSC IN) rise and fall times between 10 ns and 10 s used for characterization testing. Signal levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum values. Not production tested. The reference input of the internal amplifier is capable of rail-to-rail operation.
2:
3:
TEMPERATURE SPECIFICATIONS
Electrical Specifications: VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 F. TA = -40C to +125C. Parameters Temperature Ranges Operating Junction Temperature Range Storage Temperature Range Maximum Junction Temperature Thermal Package Resistances Thermal Resistance, MSOP8 JA -- 208 -- C/W Typical 4-layer board TA TA TJ -40 -65 -- -- -- -- +125 +150 +150 C C C Transient Steady state Sym Min Typ Max Units Conditions
2004 Microchip Technology Inc.
DS21896A-page 5
MCP1630
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 F, VIN for typical values = 5.0V, TA = -40C to +125C.
Amplifier Input Bias Current (pA)
VIN Quiescent Current (mA)
3.5 3 2.5 2 1.5 1 0.5 0
FOSC IN = DC
700 600 500 400 300 200 100 0 -100
TA = + 125C
VCM = VIN TA = + 125C
TA = - 40C
TA = + 25C
TA = + 85C TA = + 25C TA = - 40C
3
3.5
4
4.5
5
3.25
3.75
4.25
4.75
5.25
5.5
3.25
3.75
4.25
4.75
5.25 5.25
3
3.5
4
4.5
5
Input Voltage (V)
Input Voltage (V)
FIGURE 2-1: Input Voltage.
4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 3
Input Quiescent Current vs.
FIGURE 2-4: Error Amplifier Input Bias Current vs. Input Voltage.
18 16 14 12 10 8 6 4 2 0 3 3.25 3.75 3.5
FOSC IN = 1 MHz TA = + 125C
Amplifier Sink Current (mA)
VIN Quiescent Current (mA)
TA = - 40C TA = + 25C TA = + 125C
TA = - 40C
TA = + 25C
4
4.25
4.75
4.5
5
3.5
4.5
3.25
3.75
4.25
4.75
5.25
5.5
Input Voltage (V)
Input Voltage (V)
FIGURE 2-2: Input Voltage.
2 0 Amplifier Gain (db) -2 -4 -6 -8 -10 -12 -14 1M 1000000
Phase
Input Quiescent Current vs.
FIGURE 2-5: vs. Input Voltage.
Amplifier Source Current (mA) 0 -2 -4 -6 -8 -10 -12 -14 3 3.5
Error Amplifier Sink Current
Gain
250 200 Amplifier Phase Shift (degrees)
VREF = 2V RLOAD = 4.7 k CLOAD = 67 pF
150 100 50 0 10M 10000000
TA = + 125C TA = + 25C TA = - 40C
4
4.5
5
3.25
3.75
4.25
4.75
5M
Frequency (Hz)
Input Voltage (V)
FIGURE 2-3: Response.
Error Amplifier Frequency
FIGURE 2-6: Error Amplifier Source Current vs. Input Voltage.
DS21896A-page 6
2004 Microchip Technology Inc.
5.25
5.5
5.5
4
5
5.5
MCP1630
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 F, VIN for typical values = 5.0V, TA = -40C to +125C.
10 9 8 7 6 5 4 3 2 1 0 3 3.25 0.9 CS Clamp Voltage (V)
CL = 100 pF TA = + 125C
VEXT Rise Time (ns)
0.899 0.898 0.897 0.896 0.895
TA = - 40C
TA = + 125C
TA = + 25C
TA = - 40C
TA = + 25C
3.5
4
4.5
5
5.5
3
3.5
4
4.5
5
3.75
4.25
4.75
5.25
3.25
3.75
4.25
4.75
Input Voltage (V)
Input Voltage (V)
FIGURE 2-7: Voltage.
9 8 7 6 5 4 3 2 1 0 3 3.25
VEXT Rise Time vs. Input
FIGURE 2-10: Current Sense Clamp Voltage vs. Input Voltage.
2.96 UVLO Threshold (V) 2.94 2.92 2.90 2.88
Turn Off Threshold Turn On Threshold
CL = 100 pF TA = + 125C
VEXT Fall Time (ns)
TA = - 40C TA = + 25C
2.86 2.84 -40 -25 -10 5 20 35 50 65 80 95 110 125 Ambient Temperature (C)
3.5
4
4.5
5
3.75
4.25
4.75
Input Voltage (V)
5.25
5.5
FIGURE 2-8: Voltage.
25
VEXT Fall Time vs. Input
FIGURE 2-11: Temperature.
EXT Output N-Channel R DSON (ohms) 12 10 8 6 4 2 0 3
Undervoltage Lockout vs.
CS to V EXT delay (ns)
20 15 10 5 0
TA = + 25C
TA = + 125C
TA = + 125C
TA = - 40C
TA = + 25C
TA = - 40C
4
3.25
3.5
3.75
4.25
4.5
4.75
5
5.25
5.25
3.5
4.5
3.25
3.75
4.25
4.75
5.25
5.5
Input Voltage (V)
Input Voltage (V)
FIGURE 2-9: Current Sense to VEXT Delay vs. Input Voltage.
FIGURE 2-12: EXT Output N-channel RDSON vs. Input Voltage.
2004 Microchip Technology Inc.
DS21896A-page 7
5.5
3
4
5
5.5
MCP1630
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 F, VIN for typical values = 5.0V, TA = -40C to +125C.
Error Amp Input Offset Voltage (V)
EXT Output P-Channel R DSON (Ohms) 18 16 14 12 10 8 6 4 2 0 3.25 3.5 3.75 4.25 4.5 4.75 5.25 5.5 3 4 5
TA = + 25C TA = - 40C TA = + 125C
150 100 50 0 -50 -100 -150 -200 3 3.5 4 4.5 5 3.25 3.75 4.25 4.75 5.25 5.5
TA = + 25C TA = - 40C TA = + 125C
VCM IN = 1.2V
Input Voltage (V)
Input Voltage (V)
FIGURE 2-13: EXT Output P-channel RDSON vs. Input Voltage.
Error Amp Input Offset Voltage (V) 0
TA = + 125C
FIGURE 2-15: Error Amplifier Input Offset Voltage vs. Input Voltage.
-50 -100 -150 -200
TA = - 40C VCM IN = 0V
TA = + 25C
-250 3 3.5 4 4.5 5 3.25 3.75 4.25 4.75 5.25 5.5
Input Voltage (V)
FIGURE 2-14: Error Amplifier Input Offset Voltage vs. Input Voltage.
DS21896A-page 8
2004 Microchip Technology Inc.
MCP1630
3.0 MCP1630 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Name COMP FB CS OSC IN GND VEXT VIN VREF Error Amplifier Output Pin Error Amplifier Inverting Input Current Sense Input pin Oscillator Input pin Circuit Ground Pin External driver output pin Input bias pin Reference Voltage Input Pin Function
3.1
COMP Pin
3.5
GND
COMP is an internal error amplifier output pin. External compensation is connected from the FB pin to the COMP pin for control-loop stabilization. An internal voltage clamp is used to limit the maximum COMP pin voltage to 2.7V typical. This clamp is used to set the maximum peak current in the power system switch by setting a maximum limit on the CS input for peak current mode control systems.
Connect circuit ground to the GND pin. For most applications, this should be connected to the analog or quiet ground plane. Noise on this ground can affect the sensitive cycle-by-cycle comparison between the CS input and the error amplifier output.
3.6
VEXT Pin
3.2
FB Pin
FB is an internal error amplifier inverting input pin. The output (voltage or current) is sensed and fed back to the FB pin for regulation. Inverting or negative feed back is used.
VEXT is an external driver output pin. This output pin is used to determine the power system duty cycle. For high-power or high-side drives, this output should be connected to the logic-level input of the MOSFET driver. For low-power, low-side applications, the VEXT pin can be used to directly drive the gate of an N-channel MOSFET.
3.3
CS Input
3.7
VIN Pin
CS is the current sense input pin used for cycle-bycycle control for peak current mode converters. A ramp can be placed on this input for voltage or average current mode converters.
VIN is an input voltage pin. Connect the input voltage source to the VIN pin. For normal operation, the voltage on the VIN pin should be between +3.0V and +5.5V. A 0.1 F bypass capacitor should be connected between the VIN pin and the GND pin.
3.4
OSC Input 3.8 VREF Input
VREF is an external reference input pin used to regulate the output of the power system. By changing the VREF input, the output (voltage or current) of the power system can be changed. The reference voltage can range from 0V to VIN (rail to rail).
OSC is an external oscillator input pin. Typically, a microcontroller I/O pin is used to generate the OSC input. When high, the output driver (VEXT) pin is driven low. The high-to-low transition initiates the start of a new cycle. The duty cycle of the OSC input pin determines the maximum duty cycle of the power converter. For example, if the OSC input is low for 75% of the time and high for 25% of the time, the duty cycle range for the power converter is 0% to 75% maximum.
2004 Microchip Technology Inc.
DS21896A-page 9
MCP1630
4.0
4.1
DETAILED DESCRIPTION
Device Overview
4.4
Error Amp / Comparator Current Limit Function
The MCP1630 is comprised of a high-speed comparator, high-bandwidth amplifier and logic gates that can be combined with a PICmicro microcontroller to develop an advanced programmable power supply. The oscillator input and reference voltage input are generated by the PICmicro microcontroller so that switching frequency, maximum duty cycle and output voltage are programmable. Refer to Figure 4-1.
4.2
PWM
The internal amplifier is used to create an error output signal that is determined by the external VREF input and the power supply output fed back into the FB pin. The error amplifier output is rail-to-rail and clamped by a precision 2.7V. The output of the error amplifier is then divided down 3:1 and connected to the inverting input of the high-speed comparator. Since the maximum output of the error amplifier is 2.7V, the maximum input to the inverting pin of the high-speed comparator is 0.9V. This sets the peak current limit for the switching power supply. As the output load current demand increases, the error amplifier output increases, causing the inverting input pin of the high-speed comparator to increase. Eventually, the output of the error amplifier will hit the 2.7V clamp, limiting the input of the high-speed comparator to 0.9V, maximum. Even if the FB input continues to decrease (calling for more current), the inverting input is limited to 0.9V. By limiting the inverting input to 0.9V, the current-sense input (CS) is limited to 0.9V, thus limiting the output current of the power supply.
The VEXT output of the MCP1630 is determined by the output level of the internal high-speed comparator and the level of the external oscillator. When the oscillator level is high, the PWM (VEXT) output is forced low. When the external oscillator is low, the PWM output is determined by the output level of the internal highspeed comparator. During UVLO, the VEXT pin is held in the low state. During overtemperature operation, the VEXT pin is high-impedance (100 k to ground).
4.3
Normal Cycle by Cycle Control (peak current mode)
4.5
0% Duty Cycle Operation
The beginning of a cycle is defined when OSC IN transitions from a high state to a low state. For normal operation, the state of the high-speed comparator output (R) is low and the Q output of the latch is low. On the OSC IN high-to-low transition, the S and R inputs to the high-speed latch are both low and the Q output will remain unchanged (low). The output of the OR gate (VDRIVE) will transition from a high state to a low state, turning on the internal P-channel drive transistor in the output stage of the PWM. This will change the PWM output (VEXT) from a low state to a high state, turning on the power-train external switch and ramping current in the power-train magnetic device. The sensed current in the magnetic device is fed into the CS input, shown as a ramp and increases linearly. Once the sensed current ramp reaches the same voltage level as 1/3 of the EA output, the comparator output (R) changes state (low to high) and resets the PWM latch. The Q output transitions from a low state to a high state, turning on the N-channel MOSFET in the output stage which turns off the VEXT drive to the external MOSFET driver terminating the duty cycle. The OSC IN will transition from a low state to a high state while the VEXT pin remains unchanged. If the CS input ramp had never reached the same level as 1/3 of the error amplifier output, the low-to-high transition on OSC IN would terminate the duty cycle and this would be considered maximum duty cycle. In either case, while OSC IN is high, the VEXT drive pin is low, turning off the external power-train switch. The next cycle will start on the transition of the OSC IN pin from a high state to a low state.
The duty cycle of the VEXT output is capable of reaching 0% when the FB pin is held higher than the VREF pin (inverting error amplifier). This is accomplished by the rail-to-rail output capability of the error amplifier and the offset voltage of the high-speed comparator. The minimum error amplifier output voltage, divided by three, is less than the offset voltage of the high-speed comparator. In the case where the output voltage of the converter is above the desired regulation point, the FB input will be above the VREF input and the error amplifier will be pulled to the bottom rail (GND). This low voltage is divided down 3:1 by the 2R and 1R resistor and connected to the input of the high-speed comparator. This voltage will be low enough so that there is no triggering of the comparator, allowing narrow pulse widths at VEXT.
4.6
Undervoltage Lockout
When the input voltage (VIN) is < the UVLO threshold, the VEXT is held in the low-impedance state. This will ensure that, if the voltage is not adequate to operate the MCP1630, the main power supply switch will be held in the off state. When the UVLO threshold is exceeded, there is some hysteresis in the input voltage prior to the UVLO off threshold being reached. The typical hysteresis is 75 mV. Typically, the MCP1630 will not start operating until the input voltage at VIN is between 3.0V and 3.1V.
DS21896A-page 10
2004 Microchip Technology Inc.
MCP1630
4.7 Overtemperature Protection
To protect the VEXT output if shorted to VIN or GND, the MCP1630 VEXT output will be high-impedance if the junction temperature is above the thermal shutdown threshold. There is an internal 100 k pull-down resistor connected from VEXT to ground to provide some pull-down during overtemperature conditions. The protection is set to 150C typical with a hysteresis of 18C.
MCP1630 High-Speed PWM Timing Diagram
OSC IN
S COMP CS
R
Q VDRIVE
VEXT
VIN Overtemperature 0.1 A OSC IN UVLO
VIN
VEXT
Note VIN S Q GND
0.1 A CS COMP VIN FB VREF EA + 2R R 2.7V Clamp Note: During overtemperature, VEXT driver is high-impedance. 100 k + Comp R Q
Latch Truth Table S 0 0 1 1 R 0 1 0 1 Q Qn 1 0 1
FIGURE 4-1:
Cycle-by-Cycle Timing Diagram
2004 Microchip Technology Inc.
DS21896A-page 11
MCP1630
5.0
5.1
APPLICATION CIRCUITS/ ISSUES
Typical Applications
The MCP1630 high-speed PWM can be used for any circuit topology and power-train application when combined with a microcontroller. Intelligent, costeffective power systems can be developed for applications that require multiple outputs, multiple phases, adjustable outputs, temperature monitoring and calibration.
5.2
NiMH Battery Charger Application
A typical NiMH battery charger application is shown in the "Typical Application Circuit" on page 3 of this data sheet. In that example, a Single-ended Primary Inductive Converter (SEPIC) is used to provide a constant charge current to the series-connected batteries. The MCP1630 is used to regulate the charge current by monitoring the current through the battery sense resistor and providing the proper pulse width. The PIC16F818 monitors the battery voltage to provide a termination to the charge current. Additional features (trickle charge, fast charge, overvoltage protection, etc.) can be added to the system using the programmability of the microcontroller and the flexibility of the MCP1630.
5.3
Multiple Output Converters
By using additional MCP1630 devices, multiple output converters can be developed using a single microcontroller. If a two-output converter is desired, the microcontroller can provide two PWM outputs that are phased 180 apart. This will reduce the input ripple current to the source and eliminate beat frequencies.
DS21896A-page 12
2004 Microchip Technology Inc.
MCP1630
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
8-Lead MSOP Example:
XXXXX YWWNNN
1630E 412256
Legend:
XX...X YY WW NNN
Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, and traceability code.
2004 Microchip Technology Inc.
DS21896A-page 13
MCP1630
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E E1
p D 2 B n 1
A c A1 (F)
A2
L
Number of Pins Pitch A .043 Overall Height A2 .030 .037 Molded Package Thickness .000 .006 A1 Standoff E Overall Width E1 Molded Package Width D Overall Length L .016 .031 Foot Length Footprint (Reference) F Foot Angle 0 8 c Lead Thickness .003 .009 .009 .016 Lead Width B Mold Draft Angle Top 5 15 5 15 Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187
Drawing No. C04-111
Units Dimension Limits n p
MIN
INCHES NOM 8 .026 BSC .033 .193 TYP. .118 BSC .118 BSC .024 .037 REF .006 .012 -
MAX
MIN
MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0 0.08 0.22 5 5 -
MAX
1.10 0.95 0.15
0.80 8 0.23 0.40 15 15
DS21896A-page 14
2004 Microchip Technology Inc.
MCP1630
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples:
a) b) MCP1630-E/MS: Extended Temperature, 8LD MSOP package. MCP1630T-E/MS: Tape and Reel Extended Temperature, 8LD MSOP package.
Device:
MCP1630: High-Speed PWM MCP1630T: High-Speed PWM (Tape and Reel)
Temperature Range:
E
= -40C to +125C
Package:
MS = Plastic MSOP, 8-lead
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21896A-page 15
MCP1630
NOTES:
DS21896A-page 16
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21896A-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: www.microchip.com
China - Beijing
Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104
Korea
168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934
Singapore
200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
China - Chengdu
Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599
Atlanta
3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307
Taiwan
Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803
Boston
2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821
China - Fuzhou
Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
Taiwan
Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
Dallas
4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924
EUROPE
Austria
Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
China - Shanghai
Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Detroit
Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260
Denmark
Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393
Kokomo
2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387
France
Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
China - Shunde
Room 401, Hongjian Building, No. 2 Fengxiangnan Road, Ronggui Town, Shunde District, Foshan City, Guangdong 528303, China Tel: 86-757-28395507 Fax: 86-757-28395571
Los Angeles
18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338
China - Qingdao
Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205
Germany
Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
San Jose
1300 Terra Bella Avenue Mountain View, CA 94043 Tel: 650-215-1444 Fax: 650-961-0286
India
Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-22290061 Fax: 91-80-22290062
Italy
Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781
Toronto
6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
Japan
Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Netherlands
Waegenburghtplein 4 NL-5152 JR, Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
United Kingdom
505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820
05/28/04
DS21896A-page 18
2004 Microchip Technology Inc.

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